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| https://www.eptac.com/soldertip/soldertip-40-component-mounting-and-acceptability/
. To keep the component flush to the board could also be an issue. Please check 7.1.4 Hole Obstruction on page 7-12, which may be a problem when considering the solder joint and such
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-40-component-mounting-and-acceptability
. To keep the component flush to the board could also be an issue. Please check 7.1.4 Hole Obstruction on page 7-12, which may be a problem when considering the solder joint and such
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. Many engineers approach the problem by tweaking process parameters on fluxing, preheating, solder pot temperature, wave height adjustment and others, it merely be just a containment and not able to
| https://www.eptac.com/soldertip/smt-component-shifting/
. What is the likely cause of this problem and are there ways we can overcome it? Answer: Most times this is related to the components floating on the molten solder and the equipment having some vibrations, which could impact the locational position of those components
| https://www.eptac.com/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
: We are having a problem with soldering tips oxidizing and becoming unusable after a few hours use. We are using a lead-free organic rosin core solder and apply additional liquid rosin flux when soldering fine pitch components
| https://www.eptac.com/faqs/soldertips/page/3
. What are the main factors to consider when shifting from hand soldering to wave soldering? What factors should be used to justify continuing to hand solder vs
