Electronics Forum | Thu Jun 22 07:15:37 EDT 2006 | amol_kane
do you mean microvoids or macrovoids??
Electronics Forum | Tue Jun 27 12:12:05 EDT 2006 | GMan
Yes it does seem like a plating issue and analysis is being done. Thank you for your inputs.
Electronics Forum | Wed Jun 28 02:29:48 EDT 2006 | Loco
Wow, great article there mike! Thanks for digging it up for us! Kind regards, Loco.
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Tue Sep 23 10:22:40 EDT 2008 | kumaravelu
Is there any specific method or product available to implement FIFO system. Currently we stack all the D/C in a shelf and we don't have a method to pull the latest D/D first. I would appreciate any help in this regard. Sundaram
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef
We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy
Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve
Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef
It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.
