Electronics Forum: sockets (Page 2 of 31)

SMT sockets co-planarity problem

Electronics Forum | Wed May 16 02:18:02 EDT 2007 | Frank

Dave's right, if it has been shown that you are getting questionable parts from the vender, then pre-inspect them before they hit the production floor. If they are fine from the vendor and you are sure they are getting bent during the feeding action

Matte Tin finish on sockets

Electronics Forum | Tue May 16 16:36:18 EDT 2006 | dougm

Has anyone had issues with chips not making a reliable connection in sockets with a matte tin finish (RoHS compatible)? We have had issues with these types of sockets. I sent some to the manufacturer, and was told there weren't any problems. We re

Matte Tin finish on sockets

Electronics Forum | Tue May 16 18:05:05 EDT 2006 | russ

Need to switch from tin to possibly gold contacts, tin oxidises. Russ

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga

| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Socketed Parts (PLCC)

Electronics Forum | Fri Apr 05 17:38:54 EST 2002 | davef

We socket no parts prior to the wave. This practice is an artifact of the days when we�d solder PTH socketed parts from the heat of the wave being conducted through the socket leads to the leads of the component. Sockets??? Thaint sockets no more.

Socketed Parts (PLCC)

Electronics Forum | Fri Apr 05 12:58:57 EST 2002 | stefwitt

I am surprised to hear that you can wave a socket with or without component in it. What is the orientation of the socket on the board, 0 or 45 degree? Are you sure, you can remove the PLCC out of the socket after soldering? Do you have the designers

Pressing in Holtite Sockets?

Electronics Forum | Tue Aug 24 17:59:10 EDT 2010 | davef

A board support must be used to prevent bowing of the board during insertion of the sockets. It should have a flat surface with holes or a channel large enough to receive the sockets during installation. [Tyco AUGAT HOLTITE Socket Application Note 11


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