Electronics Forum | Wed May 16 02:18:02 EDT 2007 | Frank
Dave's right, if it has been shown that you are getting questionable parts from the vender, then pre-inspect them before they hit the production floor. If they are fine from the vendor and you are sure they are getting bent during the feeding action
Electronics Forum | Tue May 16 16:36:18 EDT 2006 | dougm
Has anyone had issues with chips not making a reliable connection in sockets with a matte tin finish (RoHS compatible)? We have had issues with these types of sockets. I sent some to the manufacturer, and was told there weren't any problems. We re
Electronics Forum | Tue May 16 18:05:05 EDT 2006 | russ
Need to switch from tin to possibly gold contacts, tin oxidises. Russ
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Fri Apr 05 17:38:54 EST 2002 | davef
We socket no parts prior to the wave. This practice is an artifact of the days when we�d solder PTH socketed parts from the heat of the wave being conducted through the socket leads to the leads of the component. Sockets??? Thaint sockets no more.
Electronics Forum | Fri Apr 05 12:58:57 EST 2002 | stefwitt
I am surprised to hear that you can wave a socket with or without component in it. What is the orientation of the socket on the board, 0 or 45 degree? Are you sure, you can remove the PLCC out of the socket after soldering? Do you have the designers
Electronics Forum | Tue Aug 24 17:59:10 EDT 2010 | davef
A board support must be used to prevent bowing of the board during insertion of the sockets. It should have a flat surface with holes or a channel large enough to receive the sockets during installation. [Tyco AUGAT HOLTITE Socket Application Note 11
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