Industry News: solder and ball and gap (Page 2 of 16)

Electronics Industry Volunteers Honored for Contributions to Industry and IPC

Industry News | 2011-04-20 21:26:17.0

IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO Buzz Sessions Cover Hot Industry Trends and Insight into Tomorrow’s Technology

Industry News | 2016-02-10 15:54:37.0

Tackling the hot topics that have the electronics industry “buzzing,” seven free Buzz sessions will be offered at IPC APEX EXPO®, March 15-17 at the Las Vegas Convention Center. The industry’s top technical experts will provide information and insight on subjects ranging from conformal coating and lead-free solder alloys to R&D funding and a market outlook for the global electronics supply chain.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

Excel Electronics, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Industry News | 2017-09-18 16:41:34.0

IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) Class 2, to Excel Electronics, Inc. Following an initial audit by IPC, Excel Electronics, Inc. becomes one of the trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing (QML) based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Association Connecting Electronics Industries (IPC)

Nordson Electronics Solutions to demonstrate plasma treatment and automated fluid dispensing systems for electronics manufacturing at SEMICON China 2024

Industry News | 2024-03-11 15:00:03.0

Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645

Nordson Electronics Solutions

SMTA China Presents Nine Best-Paper/Presentation Awards and Two Best Exhibit Awards at SMTA China East 2014 Conference/NEPCON China 2014

Industry News | 2014-05-12 16:06:39.0

SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

IPC Inducts Two Long-Time Volunteers into Hall of Fame Ray Prasad and Lionel Fullwood Join Illustrious Rank

Industry News | 2013-02-19 18:26:34.0

In recognition of their extraordinary contributions to IPC and the electronic interconnect industry, Ray Prasad, Ray Prasad Consultancy Group and Lionel Fullwood, WKK Distribution Ltd., were honored with the IPC Raymond E. Pritchard Hall of Fame Award.

Association Connecting Electronics Industries (IPC)


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