Electronics Forum: solder and joint (Page 2 of 389)

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders

I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder

qfp and soic joint Problem

Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith

I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

Re: qfp and soic joint Problem

Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca

All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after

SMD solder joint calculation

Electronics Forum | Terry Burnette |

Wed Jan 16 15:21:48 EST 2002

solder joint problem

Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006

We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert

I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i

solder joint appearance

Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef

Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the

Reliability of solder joint

Electronics Forum | Thu May 26 21:09:01 EDT 2005 | thaqalain

The reliability of a Gullwing component solder joint is in question when insufficient solder is evident: *at the heel of the lead *at the toe of the lead *none of the above


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