Electronics Forum | Tue Aug 09 10:01:26 EDT 2005 | pr
We have some large plated through holes, that we protect with hand placed Kapton dots before they go into the wave. Is there a better option? We are going to see if the boardhouse can put them on for us but I was curious how others are/would do this.
Electronics Forum | Wed Aug 10 12:05:11 EDT 2005 | Rob
Hi Pr, No idea what the material is - we haven't usd it for a while now, but it was flush & didn't cause any printing problems on double sided reflow. Your board house should know all about it - I would suggest some but ours are all UK or China/Tai
Electronics Forum | Tue Aug 09 22:03:38 EDT 2005 | davef
Since these are mounting holes, they're probably all the same size. Why not try rubber plugs shaped like golf tees? Try: * Dempsey Industries; 802 N. 4th St, Miamisburg, Ohio 45342; (937)-866-2345; Gary Pascoe * Shercon somewhere in CA * Harman; 36
Electronics Forum | Thu Aug 27 21:59:56 EDT 1998 | Xingsheng
Hi, Friends, Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! Have a good day Xingsheng
Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk
We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.
Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F
| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Tue Feb 09 13:47:46 EST 2010 | davef
BGA rework equipment: Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=48736 Use x-ray inspection to identify the obvious defects such as shorts, missing balls and gross solder voids.
Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel
Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only
Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro
Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve
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