Electronics Forum | Tue Dec 14 11:08:19 EST 1999 | John Thorup
I think you're on the right track Paul. You didn't mention what type of solder mask was used but I'll presume that it was LPI (liquid photo imagable). If development of the image is incomplete some mask can remain where it is unwanted. Sometimes im
Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner
We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr
Electronics Forum | Fri Oct 30 12:48:59 EDT 2009 | dannou
I've been the AOI programmer for around 5 years now. The equipment I use is the Orbotech VT-9300 & VT-9500 systems. The programming isn't too difficult, mostly Grey-scale shadow measurement through application algorithms. Three levels of lighting an
Electronics Forum | Thu Oct 29 21:16:15 EDT 2009 | mah115
Fellows, We are considering getting an AOI machine to inspect boards that our vendors are giving us (we outsource the assembly of PCBAs). We have low volumes of boards, but every time a defect does slip by our human inspectors, it causes a lot of
Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Mon Apr 14 10:50:43 EDT 2003 | emeto
Pete I'm not very informed about it but from the things I red today - 2D inspection : solder component solder joints x-ray and what ever type exsist.
Electronics Forum | Tue Apr 15 08:38:23 EDT 2003 | pjc
Don't have any specific links to papers and articles. Try searching on the IPC.org (plus APEX show http://www.goapex.org) and SMTA.org web sites. Any papers and articles on the process from equipment mfg.'s should be taken with a grain of salt. Sold
Electronics Forum | Wed Apr 30 09:13:30 EDT 2003 | pjc
Yes, there is a limitation with Transmission X-ray on double-side SMT boards, ie.: back-to-back solder joints, components on bttom side over a solder joint.
Electronics Forum | Wed Apr 30 08:00:33 EDT 2003 | pjc
Jason, In Transmission AXI the entire solder joint volume is imaged, not just a slice (no missing information) as with Cross-Section. Also, there is no signal loss from mechanical or digital image reconstruction (highest contrast and edge strength).
Electronics Forum | Mon Nov 12 06:05:15 EST 2001 | nop_e
Dear all I 'm looking the minimum X-Ray machine capability that is capable to inspect the solder joint of BGAs, Fine pitch BGA and CSP such as open, poor solder joint ,etc... What is the machine specification needed? Thank you for your advise.
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