Electronics Forum | Thu Feb 19 18:07:57 EST 2004 | davef
We're inclined to buy Russ's stuff about peel from the wave. Look here, but shield your eyes first: [ http://www.thepdfshop.co.uk/ppm/defects/Wave/asp/50.asp ] [A respectful bow to BW for the pix] Could you tell us more about: * Board direction thro
Electronics Forum | Mon Apr 21 11:55:29 EDT 2008 | realchunks
"Disturbed" usually means some form of movement. I would think your leads are moving due to warp as the board exits the reflow zone. Not knowing your profile, I would suggest checking your profile. Make sure you have adequate "above liquidous" and
Electronics Forum | Tue May 27 11:59:14 EDT 2003 | blnorman
Is anyone aware of any reports, studies, articles on the subject of silicon contamination in SnPb solder joints. We are evaluating repair of conformally coated (silicone) boards. The fear is that we will never totally remove the silicone and once i
Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy
Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Fri Jun 27 22:33:16 EDT 2003 | Ben
HI, I'm doing a dye penetrant and peel test of non-function BGA solder joints to locate the fracture surface. After applying dye, I found the dye ink just accumulate at the solder mask edge and spread everywhere after I peeled off the package. THis i
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