Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid
The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl
Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Mon Mar 30 03:10:44 EST 1998 | Patrick Ng
Hi, We have encountered de-wetting issues with gold plated components( SMT LEDs ). The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). The rest of the components on the boards are not having this
Electronics Forum | Fri Jun 27 13:02:28 EDT 2014 | spitkis2
Is this fluxed / solder paste or flux-less reflow process? Are you soldering in a nitrogen or vacuum oven? From my experience having gold-tin connections go through reflow a 2nd time does not yield defects or quality issues. However, I cannot comm
Electronics Forum | Mon Mar 30 12:55:16 EST 1998 | Justin Medernach
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Wed Apr 28 11:47:34 EDT 1999 | Frank Boyko
| | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | We are considering trying boards with White Tin solderable
Electronics Forum | Wed Apr 28 12:48:02 EDT 1999 | Justin Medernach
| | | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | | | We are considering trying boards with White Tin so
Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Thu May 10 19:19:41 EDT 2007 | rgduval
Wayne, I haven't seen anything indicating that Gold Immersion is necessary for lead free... However, it is my companies preferred finish for lead free assemblies. We've taken this stance for the following reasons: 1. Better solder quality on th
winsouce.jpg)