Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2023-06-12 21:13:08.0
HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform for networking and knowledge exchange.
Industry News | 2023-04-19 17:43:01.0
As spring blossoms arrive and everything comes to life, HELLER Shanghai continues to grow and expand its capabilities in R&D, manufacturing, and customer support. In order to better serve its customers in China and around the world, and to meet future challenges and opportunities, HELLER China has moved to a new location after 21 years at their previous facilities in Shanghai.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
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When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
