Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Thu Oct 03 18:45:56 EDT 2002 | davef
Get started with an "On-Board Forum" [blue bar an inch down from the top of the page] moderated by Jeff Schake at DEK that was a discussion focused on stencil printing issues with 0201 technology. Chris: Are you putting 0201 on flex? If so, sounds
Electronics Forum | Sat Oct 12 05:05:09 EDT 2002 | Kenture
I run 0201 on a 5 mils stencil with openting of 15X12 and did not have any issue. The major concern is the placement and CP643 did very good job. Type 3 solder pastes was used. Good luck.
Electronics Forum | Thu Sep 20 17:24:29 EDT 2001 | steveb
Have you seen any solder beading (balling) with the aperture sizes you have been using on 0201 components? Have you experimented with some of the solder bead reducing designs?
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony
Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Mon Jan 03 18:52:13 EST 2000 | Deon Nungaray
Hi John, I don't know if you are going to have a lot of luck obtaining this information. Currently 0201's are mostly used in Asia, and reliability issues have risen using these components. The problem is obtaining a reliable solder connection with a
Electronics Forum | Wed Jun 22 18:52:56 EDT 2011 | semiconjt
tTo explain what I mean...sorry for my bad Engilsh... please find short " patchwork stencil" description from EPP Europe. http://www.epp-online.de/europe/-/article/16537487/15944614/Innovators-of-laser-processing-technology /art_co_INSTANCE_0000/max
winsouce.jpg)
.gif)
