Electronics Forum | Thu Nov 04 19:51:28 EST 1999 | John
Thanks folks. The current vendor is doing an alcohol wash, top and bottom, then performing an ionic test on 100 boards. I'm not to confident in the testing because the readings for a "clean" board are 25 ugm/sq in and a "dirty" board are 40 ugm/sq in
Electronics Forum | Wed Jul 24 09:54:49 EDT 2019 | amitthepcbguy
Typically, the reliability of PCBs suffers significantly due to the increase in aspect ratio. It is not preferred to opt for high thickness boards. However, I would like to point out that your assumption seems to be wrong as board layers do not direc
Electronics Forum | Sat Jun 03 03:35:16 EDT 2006 | mika
Yes we do have a problem with this. We have by now investigate numerous lead/RoHS PCBA:s The RoHS boards are by far the most difficult one's to probe and test. Our people at the "test area" including Flying Probe and ICT they spend a lot of time to t
Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019
Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les
Electronics Forum | Tue May 22 16:07:31 EDT 2007 | francitj
We are doing a field study to test the placement accuracy and calculate cpk of some machines in our plant. From previous readings, it is suggested that you buy glass board kits from Accuspec, Topline, etc. Is that the easiest/cheapest way to go abo
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Mon Mar 03 13:18:02 EST 2003 | msivigny
Hello phil, The use of AOI systems give us the opportunity to auto-collect defect information much the way you're using them now. AOI systems become extremely effective when the collected data is used to perform some positive change into the process.
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
