Electronics Forum: thermal monitoring (Page 2 of 4)

BGA Rework - Pads being lifted

Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef

Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner

Re: Reflow Profilers

Electronics Forum | Mon Oct 26 15:59:38 EST 1998 | carlm

| What are the key feature to look for in buying a profiling product for Reflow ? | | Who's is the best and how much do these systems cost ? | | Thanks in advance. | | Hi Mark, I am currently the oven sector engineer for a large CM. I spend a lo

BGA Picture Evaluation

Electronics Forum | Wed Apr 09 20:05:21 EDT 2003 | davef

Kevin: We know of no handy approach to developing recipes. * Certainly programs provided by profiler suppliers give you a good first pass, based on your oven and solder paste. * Second pass in developing your recipe comes through trail and error chan

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F

Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther

BGA Rework Using Laser Selective Reflow

Electronics Forum | Tue Jan 04 10:00:19 EST 2005 | Carmichael

No mystery there... The balls are reflowed by conduction of heat from the package itself and the backside preheater just as in any other rework machine. The laser is just another method of precisely heating the entire package. The advantage is overa

SPC for Wave solder (defects on PCB's)

Electronics Forum | Wed Feb 15 08:47:09 EST 2006 | pjc

Yes, doing the DoEs on your wave to achieve optimum settings that deliver the best results on your worst board is correct method. If not clear on the process, there are still wave solder process classes out there you can attend or hire in-house. If y

Solder wetting test for PCB's

Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef

Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur

Oven Profile

Electronics Forum | Mon Mar 08 19:41:31 EST 2004 | Ken

Robert, what you have provided is not a "profile". It is a "recipe" or "job". I have 4 BTU VIP98's. I have hundreds of recipes...Your temps look similar to mine....but what does that have to do with the "thermal profile" as experienced by the asse

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Sat Mar 21 12:10:03 EST 1998 | Philip C. Kazmierowicz

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Sat Mar 21 16:33:09 EST 1998 | Earl Moon

| | | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | 1.


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