The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi
TR7700 SIII DT is a high performance desktop AOI solution designed for maximum precision and ease of use. Using TRI’s exclusive multi-phase lighting and next generation inspection software, TR7700 SIII DT delivers excellent defect detection with quic
Utilizing a new hybrid inspection design, the TR7700 SII Plus can leverage both stop-and-go strategy and dynamic imaging to achieve optimal inspection performance on all types of PCBAs, e.g.: Inspection Cycle Time Reduction. Simply switch the inspect
The TR7700Q 3D AOI combines the latest of 2D and 3D technologies based on digital quad fringe pattern projection to revolutionize PCB assembly inspection. The versatile programmable 3D digital fringe pattern technology covers a huge inspection range
TR7700 SIII Plus is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII Plus offers a powerful and easy to u
The TR7700QB SII is the bottom-view 3D AOI solution with 15 µm high resolution 12 MP imaging capable of metrology-grade inspection. The TR7700QB SII is designed for high coverage inspection for Through-hole technology components and dual in-line pack
The TR7700Q SII is powered by TRI's Smart Programming with auto-learning functionalities, flexible inspection algorithms, and metrology capabilities for exact measurements and data exchange for Smart Factory applications. The advanced mechanical stab
The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solut
The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI can inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart
