Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John
Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su
Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook
| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent
Electronics Forum | Wed Feb 01 18:11:43 EST 2006 | Chris
I wonder if they are concerned about getting chemicals trapped in the tented vias. If the tented vias have pin hole openings or even larger openings, chemicals from the ENIG process could become entrapped in the via holes and not washed away in the
Electronics Forum | Thu Feb 21 14:54:36 EST 2008 | shrek
KRIKIES! tenting WILL inhibit solder flow through the top-side me lad. In the meantime, me chap, have you tried to adjust wave parameters? i've read threads here that a vibrating wave will tend to push solder up through holes.
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House
I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap
Electronics Forum | Mon Apr 22 15:05:47 EDT 2002 | tim_easterling
Depending on the volume of boards you are manufacturing, the most cost effective solution would be to epoxy plug the vias prior to LPI soldermask application. The technique is common practice and most suppliers can provide it will little or no cost a
