Electronics Forum | Mon Sep 18 15:29:39 EDT 2017 | emeto
Besides the good advises above, I will add my observation. Your picture shows no ball collapse on any of the balls at this end raw. Now the question is, what kind of part is that? There is a possibility that your part is warping to cause that. It wou
Electronics Forum | Wed Aug 12 14:39:09 EDT 1998 | Mike C
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Mon Apr 30 09:20:50 EDT 2001 | Steve Zanola
We have seen the same thing. Our vendor recently change the way the BGA is fabricated and the new package warps. We are currently trying to adjust our process paramentes to fix this problem. I will try the "bake out" suggestion and see if it cor
Electronics Forum | Fri Jul 13 08:54:18 EDT 2007 | rgduval
Has your board house reviewed the PCB layer stack? Make sure that the layers are balanced in copper weight, etc? Have you tried pre-baking the boards? We just had an issue with some boards warping that have never warped before for us. It happened
Electronics Forum | Tue Jul 20 15:02:49 EDT 2010 | vetteboy86
I've seen this warp issue across several different PCB's we assemble. One of the biggest head ache's is getting the boards to transfer between machines, converyors, and inside our pick and place. Due to the warpage, transport between conveyors is dif
Electronics Forum | Wed Sep 29 04:30:27 EDT 1999 | ROBERT
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Fri Feb 27 10:54:38 EST 1998 | Earl Moon
REVISITING MULTILAYER DIMENSIONAL STABILITY AND LAMINATE INTEGRITY It has been said we must learn it all over again and again about every four years. I know Lee Ritchey said that to me about high speed digital circuit design. The same seems true for
Electronics Forum | Wed Jul 28 08:41:47 EDT 2010 | vetteboy86
I believe we are seeing some wetting issues as we have tried to bake these assemblies ourselves. Our PCB supplier is coming in next week to address the issue. Is there a rule of thumb or formula for determining correct parameters. Thanks
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related
Electronics Forum | Wed Dec 22 18:16:46 EST 2010 | padawanlinuxero
Hello ! I have a problem with one of high runner, our board comes in a seal package with dessicant cant really tell you how much RH% is inside the bag, but our board does not spend a lot of time in the shelf just some days or a couple of weeks max,
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