Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson
Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le
Electronics Forum | Mon Mar 13 14:26:45 EST 2006 | Wave Master Larry
Well, im not sure what plane you guys are on, but I can back up my what im talking about. Ya see I wnet to Soltec traingin back in 1995 for our new wave. I got a diploma proofing that I know what i'm talking about. no one else in my company has on
Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Fri Jul 13 11:33:54 EDT 2007 | realchunks
Just starting and already responsible for product quality and machine adjustment? Wow, you poor bastard. Ok, I will assume this problem happens on the bottom side of the board with a thru-hole IC. The short occurs on the side that doesn't have the
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Thu Aug 24 09:23:29 EDT 2000 | Dr. Ning-Cheng Lee
You are asking a very good question which has been an issue in the industry for a long long time. For operating at 225C, you will need a solder with melting point no lower than 270 or even 280C. HMP solder is very difficult to come by. At this stage,
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca
All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after
Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon
| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h
