Partner Websites: wetting problem (Page 2 of 4)

The Power of 2D and 3D X-ray Inspection

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection

. In the electronics world we have similar x-ray techniques for non-destructive failure analysis. A quick 2D x-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis. BGA (Ball Grid Array

ASYMTEK Products | Nordson Electronics Solutions

SMT Reflow Oven History and Trends-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print

. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2

SMT Reflow Oven History and Trends-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml

. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2

SMT Reflow Oven History and Trends-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml

. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2

PCB Libraries Forum : JEDEC Standard Footprints?

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_jedec-standard-footprints_topic2063.xml

. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound

PCB Libraries, Inc.

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf

: contact angle of Sn wetting on Cu; H: solder bump height; D: bump diameter dimension, as well as flux agent wetting force. In this study, our focus is mainly on oxide removal agent wetting

Heller Industries Inc.

Solder Selection Guide

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

. Alloys are called eutectic when the solidus and liquidus are equal. While wetting begins at the solidus temperature, best wetting is achieved at a peak temperature 15º

ASYMTEK Products | Nordson Electronics Solutions

JEDEC Standard Footprints? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063_post8485.html

. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound

PCB Libraries, Inc.

JEDEC Standard Footprints? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2063&OB=DESC.html

. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound

PCB Libraries, Inc.

JEDEC Standard Footprints? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-standard-footprints_topic2063_post8485.html

. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound

PCB Libraries, Inc.


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