ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/the-power-of-2d-and-3d-inspection
. In the electronics world we have similar x-ray techniques for non-destructive failure analysis. A quick 2D x-ray inspection provides a good insight into signs of defective connections, and a 3D CT scan can verify the problem with the added benefits of more data, building the complete picture ready for diagnosis. BGA (Ball Grid Array
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2
| http://etasmt.com:9060/te_news_industry/2021-09-01/24567.chtml
. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2
| http://etasmt.com/te_news_industry/2021-09-01/24567.chtml
. (2) Improve welding wetting power and speed up wetting. (3) Reduce the generation of solder balls, avoid bridging, and get good welding quality. 2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_jedec-standard-footprints_topic2063.xml
. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
: contact angle of Sn wetting on Cu; H: solder bump height; D: bump diameter dimension, as well as flux agent wetting force. In this study, our focus is mainly on oxide removal agent wetting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Alloys are called eutectic when the solidus and liquidus are equal. While wetting begins at the solidus temperature, best wetting is achieved at a peak temperature 15º
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/jedec-standard-footprints_topic2063_post8485.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2063&OB=DESC.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/jedec-standard-footprints_topic2063_post8485.html
. However, IPC says that the same pattern can be used for both because the Side Fillet is not required per IPC-J-STD-001. They do mention in Note 3 that there should be "Visible Wetting" but that's not possible with chips that do not have a terminal lead wraparound
