Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon
| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc
Electronics Forum | Tue Jun 20 14:19:04 EDT 2000 | Chrys Shea
Hi Mike, The Hadco design guidelines are really good - I was just there. To expand on what Dave said, scoring is an option, but I've never had good luck with it, myself. The scores are either too shallow, and I can't break the boards easily enough
Electronics Forum | Wed Oct 31 16:56:11 EDT 2007 | glenearl
Has anyone ever looked into the possibility for laser marking 1812 size X7R ceramic chip capacitors injecting sufficient energy to cause cracking when voltage is applied? If so, what were the findings? We are having failures of caps from one manufa
Electronics Forum | Fri Sep 10 09:03:52 EDT 1999 | ScottM
| | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the prec
Electronics Forum | Fri Nov 02 08:10:40 EDT 2007 | floydf
Has anyone ever looked into the possibility for > laser marking 1812 size X7R ceramic chip > capacitors injecting sufficient energy to cause > cracking when voltage is applied? If so, what > were the findings? We are having failures of > caps
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F
| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W
Electronics Forum | Fri Oct 08 16:36:28 EDT 1999 | Glenn Robertson
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Tue Aug 22 10:22:59 EDT 2000 | Wolfgang Busko
Mark: The fact that these daughter boards have to be attached to the TSOP-footprints is what makes the thing difficult cause they will be greater than the original part. One could think that a LCC-design allows for proper routing. But when it comes t
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
