Full Site - : what is solder ball collapse (Page 2 of 6)

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup

Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or

Re: all powerfull UP78..or is it..?

Electronics Forum | Fri Apr 30 15:24:12 EDT 1999 | Kevin Hussey

| Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | My question's are really : | how is the printabilit

Re: all powerfull UP78..or is it..?

Electronics Forum | Wed May 05 10:57:25 EDT 1999 | Kevin Hussey

| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |

Re: all powerfull UP78..or is it..?

Electronics Forum | Sun May 02 11:53:43 EDT 1999 | Chrys Shea

| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef

Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 17:58:44 EST 1999 | Dave F

Dave: You should see a solder smudge on the gold plating where the ball was attached, if there is (was) solder reflow during either the (1) BGA fabrication, (2) your BGA attach, and / or (3) your BGA removal. You rework will not remove the solder

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.

Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

Re: all powerfull UP78..or is it..? - Homeplates..??

Electronics Forum | Sat May 08 07:41:00 EDT 1999 | wayne sanita

hello, i have been using up-78 ultraprint for over a year now. at first we were getting lots of solder balls mainly on 0805's. this happened with all paste we used, too much solder under component leads. i have been using apertures reduced 10% homepl

Re: all powerfull UP78..or is it..? - Homeplates..??

Electronics Forum | Sun May 02 19:09:46 EDT 1999 | JohnW

| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |


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