Electronics Forum | Wed Mar 26 20:48:22 EDT 2008 | davef
Sealing clip, clamps used in semiconductor, hybrid packaging * Connor Manufacturing Services; 16233 N.E. Cameron Blvd., Portland, OR 97230; 503-256-0230 F503-256-0246 connorms.com * Electro Assembly Source; 602 Sciandro Dr, Greensburg PA 15601; 724-8
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz
We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin
Electronics Forum | Mon Jul 21 09:57:29 EDT 2008 | davef
We use a ministencil with a QFN pattern that is very similar to the orginal stencil. Here's a link to one of the better white papers on QFN rework: http://www.intersil.com/data/tb/TB389.pdf QFN with less than a 2 thou standoff are less reliable tha
Electronics Forum | Mon Aug 11 11:13:05 EDT 2008 | davef
So, how did you get some parts going one way and other parts going another way? It would be highly unusual to receive a reel packaged that way. No, don't send the data sheet. We can see that Vcc is on pin 8 of the part. What pin of this component do
Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg
We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa
Electronics Forum | Mon Aug 11 10:47:40 EDT 2008 | dphilbrick
Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!
Electronics Forum | Wed Sep 03 11:42:21 EDT 2008 | robinj
If the tarnish is really dark, it is very difficult to remove. Since it is yellowish it is only in the early stages. Replating will definitely work. I have used sulfuric acid based cleaners to remove this yellowish color. But rinse well and dry quick
Electronics Forum | Mon Aug 25 16:48:14 EDT 2008 | petep
Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sent out like BGA's for "re-balling"? Like all of you, we build, profile place and solder for reliability, but the time will come when one of these co
