Electronics Forum | Fri Oct 05 11:59:54 EDT 2001 | mparker
I am looking to learn of possible causes and solutions for the following problem. A potential customer is demanding that I use a saponifier in the aqueous wash, he has lab test results of former CM's products that leads him to believe it is necessar
Electronics Forum | Mon Oct 15 13:41:49 EDT 2001 | bschreiber
Hi Dale, I have copies of the articles of which Mike references. If you need copies for support, contact me at: bill@smartsonic.com. Rinsing should be done by ultrasonics also. Spray in atmosphere systems will not penetrate into the same tight ar
Electronics Forum | Thu Oct 18 06:29:20 EDT 2001 | Yngwie
Dave, yes, your assumption is right, We only do washing after the second reflow. The timing from the post primary reflow to wash is no longer than 2 hour. The line config is as such : DEK265 � 3x MV2F- 1x MSF � BTU - AOI � DEK265 � 3x MV2F � 1x MSF-
Electronics Forum | Mon Dec 10 16:44:51 EST 2001 | davef
Good for you!!! Similar to Steve's comments ... 1. NON-WETTING DEFECT: Yes. Your Lonco is a �stand and deliver� flux. Not some limp wrested impersonation of a flux like most nc fluxes. Without speculating about �incompatability�, recognize that
Electronics Forum | Wed Dec 19 02:24:40 EST 2001 | ianchan
Did I mention, we tried to use the same WS flux formulae to brush-cover the affected flex-PCB pads, and subject it to another round of water-wash, followed by oven-baking, and it still doesn't help abit? Oven bake : 100 deg-C, approx 15~30mins (manu
Electronics Forum | Thu Dec 20 19:41:27 EST 2001 | ianchan
I called a cuppa of indutrial friends, and they concluded that the flex-PCB in question, was being subject too high a oven-baking temperature of 100deg-C...50~60deg-C oven-baking temperature would be more appropriate for flex-PCB, due to its very pad
Electronics Forum | Tue Jan 08 11:28:30 EST 2002 | mregalia
We use NC flux exclusively for SMT and wave soldering. And it is a fairly old formula from Multicore, though we are currently qualifying a new formula. The automated soldering does not appear to be a problem. It is only the hand soldering that causes
Electronics Forum | Thu Jan 24 16:17:31 EST 2002 | mzaboogie
I have recently been asked to look into some problems that we are having at wave. It is common for us to have unsoldered joints for boards that have SMT parts epoxied to the bottom side. Recently we have had a problem with a gold plated board. The wa
Electronics Forum | Wed Mar 20 13:54:56 EST 2002 | Aaron C
I am starting to use BGAs more and more in our process, which is using water soluble paste. Taking to the Paste Rep, he had pointed out that if you add Surfactant Packs to your inline water wash, that it would help get the water underneath the BGA pa
Electronics Forum | Mon Mar 25 13:48:52 EST 2002 | bcceng
We are currently applying solder bumps to hundreds of BCC's for rework. It is impossible to print to the PWB. It is recommended to apply solder bumps to the BCC's with 63/37 alloy making the rework faster and easier. Applying the solder bump on the
