Electronics Forum: heated (Page 133 of 301)

Expanding my skills

Electronics Forum | Tue Oct 26 15:44:35 EDT 2004 | Paul_pmd

Hi Mike, Surface mount components arn't difficult to work with at all. They have pretty much the same tolorance to heat degridation as Dip packages. I suggest two Irons when working with two pole resistors and caps. Heating only one end at a time wil

Touch or no touch-up

Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef

It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h

Same wave process do not apply to all finish board

Electronics Forum | Fri Oct 14 11:56:49 EDT 2005 | patrickbruneel

Mika, 1.) Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? Answer: The thicker the board the further the solder has to travel and the more you depend on solderability of boards and components, machine

Heat guns and component damage

Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks

OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a

LASER SOLDERING

Electronics Forum | Tue Apr 11 12:40:47 EDT 2006 | Chunks

Depending on model and/or series, each one has it's own specific manufacturing guidelines you must meet in order to get a successful solder joint. Then you must couple that to what your soldering process is. Assuming you are talking all thru-hole,

smt rework

Electronics Forum | Sun Nov 19 16:37:06 EST 2006 | finepitch

Hi RJK, 2.5 years ago, I pointed out the exact same thing you did now. (please see the below link) http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7076&#Message28261 I am a competing brand's rep for 3 years, but p

Reverse Spike

Electronics Forum | Thu Aug 17 09:38:28 EDT 2006 | pjc

Having the last two zones at the reflow temp (spike) is typically done on long ovens (10 zone) running at high conveyor speeds. This enables you to achieve peak temp and TAL as per the solderpaste specs at high production rates. Concerning reverse sp

Hidden Pillow Phenomenon

Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef

"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c

Wave Cassettes and Heat convection

Electronics Forum | Mon Jan 15 09:19:29 EST 2007 | tk380514

We use Alpha EF-2202 low-VOC No-Clean flux Selective wave soldering cassettes Bottom pre-heating wave soldering machine We have one component that will not solder properly: http://www.epcos.com/web/generator/Web/Sections/ProductCatalog/Capacitors/Ul

SMT BGA capable oven and stencil printer.

Electronics Forum | Tue Nov 20 17:07:20 EST 2007 | kennyrebbe

I am looking for a new semi automatic Stencil printer, and reflow oven that is capable of doing double sided boards with BGA�s. We currently own a Manncorp 4500R stencil printer https://www.manncorp.com/4x00_stencil_printers/index.php?view=overview&a


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