Electronics Forum | Tue Sep 09 16:00:07 EDT 2008 | ppcbs
We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 y
Electronics Forum | Tue Oct 28 19:47:05 EDT 2008 | davef
Your gold might be a bit thin after you consider fabricator's tolerance. IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended specification is
Electronics Forum | Thu Jan 15 12:32:08 EST 2009 | vleasher
After doing some more research it looks like Loctite made a material called Cornerbond 3515 that seems as if it has the characteristics we are looking for such as curing after the solder is liquidous. But it appears that it isn't manufactured anymore
Electronics Forum | Thu Apr 09 06:22:27 EDT 2009 | qualityguy
We aware of the extend time for cure, and in the CA activity we tried plasma etch and expose the sample to the current process, a screen test of 4 cycles -50C to 125C and the CC held in place. Std IPC tape test passed in current process and modifie
Electronics Forum | Mon Oct 11 12:02:32 EDT 2010 | smt_guy
Hi, we have been baking parts like QFP's and BGA once they past MSL requirements. But now I have some SOIC's with MSL 3 Rating that needs to be baked. I wonder if I can bake them together with the PVC Antistatic Tubes. Can these tubes withstand the
Electronics Forum | Mon Oct 11 14:01:25 EDT 2010 | clampron
Good Afternoon, The PVC tubes, unless marked otherwise, cannot see 125 degrees C. I have baked smaller level 3 parts at 40 degrees C for 9 days in the tube. I had tried several different temperatures but found out the the max temp for the tubes is d
Electronics Forum | Wed Nov 17 07:39:20 EST 2010 | jax
Most PCB manufacturers should be able to fall between 1.25um-5.00um for Pb-Free HASL. I doubt you will get anyone to agree to anything higher. If you are going to require an average thickness, make sure you also state "No Copper exposure allowed".
Electronics Forum | Thu May 31 22:35:23 EDT 2012 | jacktan
I have encountered PCB delam issue with high density PCB. PCB has 42 layers , 5 mm thickness ,laminate material is NelcoN4000-13EP,Tg 210C and Td 350C. Have pre-bake at 125 c for 12 hrs before assy.My reflow temp is standard with 243 peak and TAL is
Electronics Forum | Thu Jun 27 23:49:40 EDT 2013 | cedric77
I had a solder paste SAC305 T4, with flux loading of 11.5%. After retrieivng out from fridge(5deg) after 48hrs, the paste turn dry (like dry mud? and after double checking the flux loading it becomes 12.5%. Has anyone ever experience this or any opi
Electronics Forum | Fri Jun 20 08:04:21 EDT 2014 | emeto
0.8m/min is a different story. I run my 10 zone reflow ovens with that speed all the time and never had a problem. For the short profile I mentioned the speed I used is even higher(about 1.25m/min). No issues with parts moving. Regards, Emil
