Electronics Forum | Wed Sep 10 14:19:51 EDT 2008 | stepheniii
Root cause analysis is simply looking for what caused a problem, then looking for what caused that, and so on, until you reach someone you don't like, or can pass the buck onto. I don't see why Vlad's method is better than tweaking your knobs until y
Electronics Forum | Wed Sep 10 17:12:55 EDT 2008 | gregoryyork
I dont know about analysis on boards it is OK as long as the people carrying it out know how to interogate the answers.I worked on a problem just last week where an analysis house in China tested the resist then the pads and found on both surfaces C
Electronics Forum | Tue Jan 20 17:00:05 EST 2009 | davef
For lack of a better description, we'd say, "Yes, that could be corrosion." Regardless of what you call it, it looks nasty and should not be allowed on bare boards of any sort. Based on your picture, we can't tell you whether it's related to your con
Electronics Forum | Thu Jul 30 14:16:27 EDT 2009 | joeherz
We are running a selective solder machine using SN100C alloy. We have had J-STD-001 analysis performed every 2 months and our last analysis showed our nickel content at 0.104%. The max allowed is 0.100%. We changed out the pot (only 30 lbs) but I'
Electronics Forum | Fri Sep 04 13:49:30 EDT 2009 | xps
Hi, in our company, we had performed a failure analysis on some PCB finishing ENIG faulty, cause detachement of heavy components. So we performed a SEM / EDX analysis on the nickel and we discover a 20 % of carbon instead of the standard 0.04% (on s
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Thu May 28 01:58:40 EDT 2015 | alexeis
Hi, To maximize efficiency of the use of AOI machine inline, our customers perform statistical analyzes. Until few month ago, this analysis was done manually. These days, we have been implemented full working project which performs analysis of AOI m
Electronics Forum | Thu Mar 23 02:10:59 EDT 2017 | alexeis
Hi, Based on our experience, you can collect X-Ray analysis of solder joints and calculate values of SPC (such as PP/PPK and GR&R). Now, you can find, based on this calculated values, if your production is good or not. Also, this helps you to detect
Electronics Forum | Wed Jun 06 02:59:11 EDT 2018 | buckcho
Mr. Evtimov, Koh Young and Parmi have this option in their SPC software. You can also choose either Volume, Area, position, height (both in um or %). Here is a screenshot from Parmi. Unfortunatelly i cant find my old Koh Young screenshots. Parmi has
Electronics Forum | Thu May 16 07:40:09 EDT 2019 | Matt
Hey Everyone, we have recently been discovering an increase of failed MLCC capacitors across various builds and after being in the field for some time. Vendor reports that a "high energy" event occurred but the detail is limited and i'm left looking
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