Electronics Forum | Tue Jan 02 14:50:37 EST 2001 | fmonette
Dear Vicki, If you decide to use high temp paste, I suggest that you verify the rating of the components, especially for moisture-sensitive devices which are normally qualified at peak reflow temperatures of 220-235C. The specified floor life will
Electronics Forum | Mon Nov 01 22:16:04 EST 1999 | Dean
Without a detailed description of the suspect parts It is difficult to pin-point the exact solution to your process problem. However, whenever possible avoid non-value added additions to your current process. Here is the reality of the situation:
Electronics Forum | Fri Apr 03 03:41:04 EST 1998 | Frank J. de Klein
150 secs. On bilayer boards (Cu only at top and bottom) you can typically not reach differences top to bottom bigger then 35-40 C. For multilayers however, the maximum is 15-20 C. If you actively cool a multi- layer at the bottom during the 2nd pass,
Electronics Forum | Wed Jun 03 13:50:32 EDT 1998 | Chrys
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Tue Sep 04 11:26:12 EDT 2001 | Jean Michel
During the solderin of a double side board, how can I calculate the maximum weight of a component I can put in the first side to avoid the component fall down in the oven (depending on the soler join surface) ? Are there some rules ?
Electronics Forum | Mon Aug 13 16:07:08 EDT 2007 | dyoungquist
We run double sided surface mount boards through our Heller oven without any parts falling off the bottom side unless they are too big/heavy. The trick we use is to set the bottom side temperature in the final 3 heat zones 10C-20C lower than the top
Electronics Forum | Thu May 16 15:37:45 EDT 2002 | Hussman69
I fit you in where you work!
Electronics Forum | Fri Aug 10 14:43:27 EDT 2007 | judym
When running some double sided reflow boards through the Heller oven, some of the caps/ res's are falling off the bottom side of the board. I understand if the parts are too heavy they wont stay in the molten solder, but these particular parts are no
Electronics Forum | Fri Sep 07 09:19:44 EDT 2001 | Hussman
Jean, A lot depends on your process. can you add a dot of adhesive after screen printing and before placement? This works well for larger heavier parts. A second suggeestion is to reprofile your board. Try keeping the bottom side cooler. I do t
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