New Equipment | Assembly Services
Supplier: Shenzhen Grande Electronics Layers: 4 PCB：FR-4/1.6mm, 1oz finished copper Project: Parking Equipment and Systems PCB Assembly Process | Introduction To PCBA | PCBA Grande Surface Treatment: ENIG PCBA Lead time:2-3 weeks Packing: Anti-stati
New Equipment | Board Handling - Storage
供應商：格蘭德電子 層數：4 應用：包裝機 完整的 PCB 組裝-優質 PCBA 公司 Grande PCB：FR4/1.6mm/1oz 最小通孔：0.2mm 表面處理：ENIG PCBA 交貨時間：3-4 週 測試：100% 電子測試 標準翹曲： [Description] 1, Turnkey solution for Packaging Machine Complete PCB Assembly- PCBA Company Shenzhen Grande 2, PCB Ass
New Equipment | Selective Soldering
Laser Selective Reflow (LSR) uses a uniform defocused laser beam over a specifically tailored area on a PCB with controlled beam intensity to implement novel soldering on specific component(or several components) while not heating up potentially the
Heller 1809 Mark III SMT Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III SMT Reflow Oven Product description: Heller 1809 Mark III SMT Reflow Oven Heller 1809 Mark III SMT Reflow Oven Specifications: These workhorses provid
Heller 1707 Mark III SMT Reflow Oven SMT Reflow Oven Reflow Oven Heller 1707 Mark III SMT Reflow Oven Product description: Heller 1707 Mark III SMT Reflow Oven Heller 1707 Mark III SMT Reflow Oven Specifications: These workhorses provid
Heller 1707 Mark III SMT Reflow Oven Reflow Oven SMT Reflow Oven Heller 1707 Mark III SMT Reflow Oven Heller 1707 Mark III Product description: Heller 1707 Mark III SMT Reflow Oven INQUIRY Heller 1707 Mark III SMT Reflow Oven Pro
Flason SMT Soldering Oven F8 Name: SMT Reflow Oven Heating zones: 8 Heating method: Hot Air Usage: SMT Assembly line Product description: china second hand SMT Reflow Oven-Good Price! Good Quality! Good Service! INQUIRY China seco
Heller 1913 MARK III SMT REFLOW OVEN REFLOW OVEN SMT REFLOW OVEN Heller 1913 MARK III SMT REFLOW OVEN Product description: Heller 1913 MARK III SMT REFLOW OVEN Heller 1913 MARK III SMT REFLOW OVEN Specifications: The ultimate high volum
Heller 1913 MARK III SMT REFLOW OVEN Reflow Oven SMT Reflow Oven Heller 1913 MARK III SMT REFLOW OVEN Heller 1913 MARK III Product description: Heller 1913 MARK III SMT REFLOW OVEN INQUIRY Heller 1913 MARK III SMT REFLOW OVEN Pro
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
