Electronics Forum | Sat Mar 24 16:34:06 EST 2001 | Stefan
Can you increase the placement force on your P&P machine? It should squeeze the solder paste to all sides including the heel.
Electronics Forum | Mon Jan 31 14:08:26 EST 2000 | Ashok Dhawan
I have got a number of assemblies back from a customer with feedback that the solder fillet is less than 25% of chip height per IPC-Standard-610B Class 2. Most of my joints are having good wetting but fillet height does not meet min ht requirement of
Electronics Forum | Fri Mar 12 11:59:50 EST 1999 | Ray Morford
AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards are no
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Thu Oct 24 13:32:03 EDT 2002 | russ
There are many factors that will affect post soldering height. Lead shape/type, pad geometry, fillet formation, etc... You will need to measure each type of component before and after reflow. Russ
Electronics Forum | Thu Oct 31 09:28:15 EST 2002 | russ
Toe fillets are not required per IPC, you can actually have toe overhang. Russ
Electronics Forum | Wed Nov 20 09:23:58 EST 2002 | Adam
Is it possible to achieve a 100% top-side solder fillet where pin 1 on the device is attached to a ground plane ? we've optimised the wavesoldering and fluxing operations, but without much success on that pin, every other pin is fine. Any advice woul
Electronics Forum | Thu Apr 17 13:02:28 EDT 2003 | Takfire
Thanks Dave! What level of voiding is acceptable? Would you please let me know if there is an EIA or other industry standard detailing solder joint quality? I will begin researching the background information you provided. Thanks again for your kin
Electronics Forum | Thu Apr 17 16:41:37 EDT 2003 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09%
Electronics Forum | Thu Apr 17 17:41:13 EDT 2003 | Takfire
Dave, I truly appreciate your efforts in providing information. Excellent input with the fishbone data. I will put together a presentation later tonight. I hope to return the favor in the future in regards to MLCC manufacturing or application.
