Electronics Forum: increase smt capacity (Page 14 of 40)

SMT Capacity & efficiency

Electronics Forum | Thu Aug 27 05:49:53 EDT 2015 | alexeis

Hi, To calculate both values you need: 1. Theoretical speed of all machines (Printer, SMT, Reflow). This is a basic upper limit value of speed. Use it for calculate a maximal theoretical values as upper limit. For real values, read next. 2. High r

SMT Line Utilization Rate

Electronics Forum | Wed Mar 03 17:09:07 EST 2021 | archsystemsiot

This thread is not new, but this is a great question- wish we'd seen it sooner. In our experience, manufacturers are only using 10-50% of their machines' capacity. Many on here will agree that it's common for electronics manufacturers to accept low S

Juki KE-750 T & Z servo failures

Electronics Forum | Fri Aug 30 15:44:51 EDT 2019 | valentink

I will try outline Theta and Z-axis servo issues, we were facing last time. Story behind. Our 750 is used seldom and last time after switching it on initialization procedure ends with T axis of right head: Servo alarm. Opening front cover of 750 two

Siemens SiPlace, Model 80 S20 FS02

Electronics Forum | Thu Jul 27 22:49:18 EDT 2006 | chrispy1963

I am searching for any information concerning this type of SMT placement equipment. Currently our facility utilizes Panasonic CM202 inline with MyData MY12 machines for our production builds. Our managment has found a couple of the Siemens machines

Solder balls

Electronics Forum | Mon May 07 17:59:07 EDT 2001 | davef

One thing I forgot to add about the globs of solder on your bottom side SMT components after wave soldering: The excess solder is likely reducing the reliability of these components, because of the difference in CTE betweeen the ceramic base on the

MS Level 6

Electronics Forum | Wed Jun 20 18:21:33 EDT 2001 | davep

What experience does anyone have with a MS level 6 SMT component? I have a part that must go from component baking to reflow within six hours. According to the component mfg, a sealed MS bag w/ desicant is not sufficient protection to increase the

Reflow Oven Atmosphere Purity

Electronics Forum | Wed May 12 07:56:31 EDT 1999 | Joe Belmonte

Folks, I am interested in knowing what level of Nitrogen purity you are running in your reflow ovens for standard SMT assembly? It seems over the last several years people are increasing the Oxygen level in thier reflow oven atmosphere. What purity L

QFP with Sn Pin Plating

Electronics Forum | Fri Jan 21 00:51:56 EST 2005 | WDLau

Hi All, could anyone advise me what we need to pay attention to if we will be usingthe Sn Pin plating as lead free requirement in SMT reflow process, is it a need to increase the Temp Profile by 10~15 Degree c as Sn with Melting ppoint 232C, Please

Lead Free Stencil Design

Electronics Forum | Wed Jul 13 14:56:53 EDT 2005 | jdengler

I read the Cookson/Alpha paper "Optimizing stencil design for Lead-free SMT processing". I interpreted it to mean that if you had a mid chip solder ball (MCSB) problem the "radiused inverted home plate of 20/60/20 style" had the greatest impact on r

SMT Tape Splicer

Electronics Forum | Wed Nov 02 12:41:07 EST 2005 | Tapesplice.com

Tape Splicer and Tape Splicing Products for splicing a seamless reel of SMD Components. Tape Splicing increases throughputs and yields by 15-20%. We also manufacture Antistatic Clean Room Lab Coats, Clean Room Coveralls, ESD Grounding Straps, Cleanro


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