Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter
Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol
Electronics Forum | Mon Nov 02 07:32:44 EST 2009 | umar
Hi..., We have build the PCBA base on IPC 610 and J-std-001 class 3 product, All the ESD pre caution been implement at my production side, ESD flooring, wear the ESD smock, wear the ESD shoe, use the finger coat and those not use the finger coat the
Electronics Forum | Mon Mar 08 05:03:24 EST 2010 | grahamcooper22
Hi, I fully agree with isd.jww. The difference in the solder joint appearance of the 2 joints highlighted could be down to a few reasons...reflow profile (I know you've checked, but have you stuck a thermocouple on this actual joint ? ), contaminatio
Electronics Forum | Mon Sep 26 12:58:33 EDT 2011 | action_101
So you are saying that building to class III is going to prevent failures? I disagree. Class III is trying to hit target condition in every aspect of the production of the circuit board. That my friend does not ensure failures from happening. I see
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Sat Nov 23 12:39:18 EST 2013 | joeherz
We installed a Soltec Delta 3 a few months ago and have been trying to run with a VOC free no clean. We're using SN100C in the pot. We are spraying the material and have top/bottom preheat. Evaporation of the water in the flux is a bit of a stru
Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo
Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.
Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf
The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in
Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval
Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe