Electronics Forum | Tue Oct 31 07:50:22 EST 2006 | markb
SWAG - Was your experiment on the board with the large ground plane? The board we are seeing issues with also has a large ground plane (approx 50% of PCB), and 90% of the delamination occurs in that area. The delamination is about the size of a sil
Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67
Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like
Electronics Forum | Fri Nov 09 10:37:38 EST 2007 | devajj
We have started using QFN packages in large volume and are having problems with no-solders. We are using 6mil stencil with 1x1 paste print to pad. These also have thermal pads with thru vias that we reduce the stencil aperture by 1/4. Board also ha
Electronics Forum | Fri Apr 18 11:38:50 EDT 2008 | sueph
I have a small board with some chips and 2 connectors (1 large and 1 small) with gull wing leads. The large connector has some "disturbed" solder joints per my QA people. These joints are toward the ends of the connector, not toward the middle. Th
Electronics Forum | Sun Nov 30 10:20:27 EST 2008 | grantp
Hi, We have a custom large board and we need to do about 10-20 of them a month. Can anyone recommend a good quality manual stencil printer that we could use for it? Does not make any sense purchasing an automatic printer for such low volume. Grant
Electronics Forum | Wed Feb 10 22:32:22 EST 2010 | davef
"Because of the rapid curing features of this product, large amounts of heat are generated when large masses of material are mixed at one time."[ITW Plexus MA310 TDS] Questions are: * Have you looked at the exotherm curve for this stuff? * Can the c
Electronics Forum | Fri Jan 28 14:53:29 EST 2011 | bandjwet
Dear SMTNetters I have a fairly large pile of different size ESD part trays that we collect over time from clients. The jobs have long since come and gone. Does anyone have any ideas on who to trade/barter with to get them out of our plant? Regar
Electronics Forum | Fri Jul 08 08:01:32 EDT 2011 | joekirin
Hello, I am having a problem with a large amount of solder balls surrounding mostly the legs of fine pitch ics. There seems to be a large collection in gap between the pad and the solder resist. They do not easily wash out. Our profile seems to be
Electronics Forum | Thu Jan 02 07:04:57 EST 2020 | dontfeedphils
Pretty large solder-ball. Looks like it may have come from the ground pad since it's so large, in which case I would reduce the print coverage on the middle/ground pad and see how it works for you. You verified that these parts have the groundpad a
Electronics Forum | Wed Jun 11 11:12:10 EDT 2003 | JB
We rarely use the tack-time on our machines, even if we run products that are populated with large components. ( ICS, Tant caps etc.) There is a default tacktime for each component on the component library, is called Speed Data. For the components
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