Electronics Forum: large (Page 14 of 189)

surface mount connector, disturbed solder

Electronics Forum | Fri Apr 18 11:38:50 EDT 2008 | sueph

I have a small board with some chips and 2 connectors (1 large and 1 small) with gull wing leads. The large connector has some "disturbed" solder joints per my QA people. These joints are toward the ends of the connector, not toward the middle. Th

Good Manual Printer for Large Boards

Electronics Forum | Sun Nov 30 10:20:27 EST 2008 | grantp

Hi, We have a custom large board and we need to do about 10-20 of them a month. Can anyone recommend a good quality manual stencil printer that we could use for it? Does not make any sense purchasing an automatic printer for such low volume. Grant

Epoxy damaging SMT Components

Electronics Forum | Wed Feb 10 22:32:22 EST 2010 | davef

"Because of the rapid curing features of this product, large amounts of heat are generated when large masses of material are mixed at one time."[ITW Plexus MA310 TDS] Questions are: * Have you looked at the exotherm curve for this stuff? * Can the c

Large Pile of Trays for BGAs, LGAs and QFPs

Electronics Forum | Fri Jan 28 14:53:29 EST 2011 | bandjwet

Dear SMTNetters I have a fairly large pile of different size ESD part trays that we collect over time from clients. The jobs have long since come and gone. Does anyone have any ideas on who to trade/barter with to get them out of our plant? Regar

Excessive solder balls!

Electronics Forum | Fri Jul 08 08:01:32 EDT 2011 | joekirin

Hello, I am having a problem with a large amount of solder balls surrounding mostly the legs of fine pitch ics. There seems to be a large collection in gap between the pad and the solder resist. They do not easily wash out. Our profile seems to be

solder ball

Electronics Forum | Thu Jan 02 07:04:57 EST 2020 | dontfeedphils

Pretty large solder-ball. Looks like it may have come from the ground pad since it's so large, in which case I would reduce the print coverage on the middle/ground pad and see how it works for you. You verified that these parts have the groundpad a

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 11:12:10 EDT 2003 | JB

We rarely use the tack-time on our machines, even if we run products that are populated with large components. ( ICS, Tant caps etc.) There is a default tacktime for each component on the component library, is called Speed Data. For the components

Pin in Paste with dispenser

Electronics Forum | Mon Jan 24 04:26:32 EST 2005 | Hannu

Morning all, Has anybody done any pin in paste job with a dispenser? I read somewhere that the needle i.d. should be slightly larger than the hole diameter, but with holes of 1.4 mm I would have to work with a very large needle indeed. How does past

Samsung SM320 VS Assembleon 8 head Opal XII

Electronics Forum | Wed Dec 21 10:00:28 EST 2005 | russ

I'm curious about the "large infrastructure" statement. Do you or anyone believe that the large infrastructure is better? Sometimes, I am not so sure. I actually rate Dynatechs service as some of the best I have had. (No, I do not work for Dynatec

SN100C vs. SAC 305 wave soldering

Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york

Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili

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