Teaching video on PCB through hole repair. BEST instructors teach the method for repair of a damaged eyelet using a multitude of different close up and angled views. Repair is completed per the IPC 7721 instructions. http://www.solder.net
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
Industry News | 2009-10-17 09:43:47.0
Reduce PCB Repair Costs
Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
New Equipment | Assembly Services
The bugler stamp pad Manual screen printing machine Product name: hand machine (medium) Applicable objects: SMT Substrates thickness range: 0.1 ~ 100 (mm) Product type: brand new Printing color: monochrome Printin
Used SMT Equipment | Conveyors
vintage 2007 1 Segment transport hight 850 +/- 50mm PCB edge pad 3mm PCB size 70x70mm-460x460mm barcode scanner
With SE500-X™ - 100% 3D solder paste inspection system, CyberOptics pushes inspection speed to the highest level possible. The SE500-X™ is capable of inspecting the most demanding assemblies with 80cm²/sec inspection speed without compromising on mea
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE350-L 3D SPI 3-D Solder Paste Inspection Machine Model: SE350-L Vintage: 2010 OS: Windows XP Calibration Kit & Manuals Included Calibration-Free Sensor Technology Integrated SE500 Sensor Assembly Inspecs Pad Sizes Down To 01
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Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
