Electronics Forum | Tue Apr 14 09:01:36 EDT 1998 | Justin Medernach
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef
If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Thu Sep 02 10:24:35 EDT 2004 | dj_jago
Greetings from the UK: I have been quite fortunate to lead (no pun intended) our company towards lead free sooner rater than later. One of our customers produces a product which is refurbushed every 6 months or so and sent back into the market. A
Electronics Forum | Fri Jun 22 13:47:51 EDT 2007 | 18424
Good afternoon all, I am looking for help from you folks to find a place that can do metalurgical analysis on components and contamination. We are an OEM and just recently received back from the customer several units that failed in the field after
Electronics Forum | Fri Jun 22 13:49:46 EDT 2007 | 18424
Good afternoon all, I am looking for help from you folks to find a place that can do metalurgical analysis on components and contamination. We are an OEM and just recently received back from the customer several units that failed in the field after
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
Electronics Forum | Tue Apr 10 13:12:41 EDT 2001 | davef
You've told us nothing about your situation, process, boards, or anything!!! If you leave some boards with very fine solder connections on the shelf for a cuppla years, the grain will become coarse. What do you mean when you say "grainy"? What is
