Electronics Forum | Fri Feb 15 12:52:14 EST 2019 | SMTA-Joe
SMTA-Chris, can I have more info about these items, and rep contact info?
Electronics Forum | Thu Mar 28 13:38:35 EDT 2019 | pavel_murtishev
Davef, Thank you for the comprehensive reply. I do really appreciate your help. Regards
Electronics Forum | Wed Jul 03 09:47:39 EDT 2019 | SMTA-Pat
We have seen that vias included in the PCB under the thermal pad will give less voiding.
Electronics Forum | Sun Sep 08 22:38:23 EDT 2019 | sssamw
what's your final verified ok stencil thickness for the QFN and BGA?
Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw
That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.
Electronics Forum | Fri Jul 19 22:25:06 EDT 2019 | dhanish
yes..there is no fillet as shown in the picture..
Electronics Forum | Tue Feb 11 15:17:49 EST 2020 | emeto
Your profile should be close to this.
Electronics Forum | Fri Jul 17 21:54:18 EDT 2020 | davef
That is unusual. Is it a once-off or SOP for that part?
Electronics Forum | Wed Jul 29 16:04:03 EDT 2020 | emeto
Very interesting. Looking at the wire bonding, it seems that it is all normal.
Electronics Forum | Thu Jun 19 20:09:19 EDT 2003 | John Tobias
I'm new to this forum. I hope that this isn't an old topic. Sales people in my company have told me that there is resistance to the use of QFN (LPCC) packages by small Asian (primarily Korean Repeaters and Chinese CATV) manufacturing houses. Does
