Electronics Forum | Fri Oct 07 14:37:36 EDT 2005 | jimmyjames
Could I get some help please? I have a Heller 1700EXL, 7 zone oven and I'm trying to figure out a better way of off-loading my completed boards. What I have now is simply a small table at the exit of the oven with about an 8" drop from the top of
Electronics Forum | Sat Feb 08 06:16:07 EST 2014 | spoiltforchoice
http://www.ddmnovastar.com/reflow-ovens/medium-to-high-volume/sf-lead-free-reflow-oven suggests 200CFM per vent?
Electronics Forum | Tue Aug 26 11:15:47 EDT 2003 | blnorman
We use HTN (high temperature nylon - Zytel) connectors in our reflow ovens with no warping, bubbling, or cracking. You can also use PPA (Amodel).
Electronics Forum | Tue Mar 09 12:57:43 EST 1999 | Jan Pasternak
I want to identify a pre-production prototype test house to evaluate new parts in the Chicagoland area. Capability of running high speed pick and place and soldering components to test board.We will submit boards and parts.
Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson
First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y
Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis
There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======
Electronics Forum | Wed Sep 15 12:07:50 EDT 1999 | Earl Moon
| | Hi, | | | | Can someone pls suggest to me the best reflow temperature setting | | for a force air convection oven. The details is as follow. | | 1) Heller 1700s | | 2) 12 zone---6 top and 6 bot | | 3) Solder paste --- Qualitek 691 non clean | |
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
