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A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Technical Library | 2022-06-27 16:50:26.0

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions.

Institute of Electrical and Electronics Engineers (IEEE)

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

Technical Library | 2020-10-27 02:07:31.0

For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.

Sanmina-SCI

Symor ESD storage dry cabinet(Working principle)

Technical Library | 2019-04-08 23:21:29.0

Climatest Symor® adopts molecular sieve to dry air, the whole system is controlled by microcomputer, when humidity is high, It will start to absorb moisture,when the humidity reach the pre-set value, it will stop absorbing, and then discharge the water to outside the cabinet by heating,again and again by automatic control. The most effective and environment-friendly moisture-absorbing desiccant is molecular sieve, molecular sieve is the microporous crystal material synthesized by silicon and aluminium oxide. In order to keep the crystal net discharge to be zero, atoms with cations are located in the crystal structure.and the cation used in these synthetic crystals is usually sodium. At present, there are two kinds of molecular sieves widely used in the dry box industry: Class A and Class X. Molecular sieves are synthesized, shaped and activated under strictly controlled production processes. The whole controlled sythesis process can ensure consistency of the three-dimensional pore size. 3A molecular sieve pore size is 3 angstroms, 4A molecular sieve pore size is 4 angstroms; 13X molecular sieve pore size is 8.5 angstroms. The working principle of molecular sieve: Molecular sieves adsorb molecules onto the crystal surface by physical attraction force. Since 95% surface area of the molecular sieve is within aperture,it needs to screen the adjacent molecules by different size. Only small size molecules can enter into the inner adsorption surface of the molecular sieve through the crystal aperture. This selective adsorption phenomenon is called molecular sieve effect. The molecular sieve adsorption capacity and charge density (polarity) are further related to the adsorbed molecules. The molecular sieves can further distinguish which of the mixed molecules can be adsorbed and determine to what extent the charge density can allow the molecules to be adsorbed onto the crystal. Water molecules are particularly small (2.6 angstroms), that belong to highly polar molecules (very strong positive and negative electron density), and are easily adsorbed by molecular sieves, even under very low moisture condition,once the water molecules are adsorbed,they will be firmly fixed on the crystal. The environment-friendly moisture absorption device is equipped with molecular sieve. When it’s absorbing, the memory alloy controller is in tensile state, and the spring is in contractive state,which just make the valve contact the outer baffle, this insulates the outside air from inside dry box air to achieve dehumidification purpose; and after molecular sieve absorbed moisture inside dry box and become saturated, the program will automatically control the memory alloy device to shrink it so that the valve reaches the inner baffle position. Meanwhile, due to the shrinkage of the memory alloy, the spring is stretched and the valve is pulled out of the outer baffle,so that the moisture in molecular sieve will be discharged into the outside. after the dehumidifying process finished, the program automatically control and reset the memory alloy and spring,to restart absorbing status.

Symor Instrument Equipment Co.,Ltd

Material Aging Test-UV Weathering Test Chamber

Technical Library | 2019-11-15 02:20:26.0

Material Aging Test-UV Weathering Test Chamber 1.What is UV aging? UV aging chambers use fluorescent ultraviolet lamp as light source to simulate UV radiation and condensation in natural sunlight, and to carry out accelerated weather resistance test in order to obtain the result of weather resistance of the material. UV aging detection is widely used in non-metallic materials, organic materials (such as coatings, paints, rubber, plastics and their products) under the change of sunlight, humidity, temperature, condensation and other climatic conditions to test the aging degree and situation of related products and materials. 2.Why we should do UV aging test? When the product is placed in the ambient environment, there will be different problems taken place, such as appearance changes, including cracking, speckle, powdering or color change, and even performance degradation,which may be due to the loss of components in the resin resulting in chemical bonds changes inside the molecular structure, this is mainly caused by sunlight, industrial exclusion of waste gas, bacteria and so on. The aging performance of the product directly affects the lifespan of the product, so aging test become significant,non-metallic materials, organic materials (such as paints, paints, rubber, plastics and their products) are subject to changes in sunlight, humidity, temperature, condensation and other climatic conditions to test the degree and condition of aging of related products and materials. The natural aging test is to put the plastic specimen under the sun exposure, and it is directly under the natural climate environment,to test the material performance under various factors such as light, heat energy, atmospheric humidity, oxygen and ozone, industrial pollution and the like, the most harsh climate condition should be selected,or near the actual application area of the material, the test site shall be open and flat, no obstacle to affect the test results,the specimen holder shall be facing the equator and at an angle of 45 ° from the ground. When the main performance index of the specimen has been reduced, the test s/b terminated when it achieve the minimum allowable use value . in most case,the test is terminated when the product primary performance index falls to 50% of the initial value. The natural aging process is a very slow process, and there is a great difference in different geographical conditions, which brings difficulties to evaluate the aging resistance of the product. It is an attempt to make an evaluation of the aging performance of the plastic in a shorter time,that is accelerated aging test. The accelerated aging test can be used to simulate the human light source of the fluorescent lamp, including the carbon arc lamp, the xenon arc lamp and the fluorescent ultraviolet lamp, and the artificial light sources can generate more light than the natural sunlight on the ground. When these artificial light sources are used, it is also common to use the combination of the condenser to simulate the rain drop, the dew and the like to conduct the aging test on the product.

Symor Instrument Equipment Co.,Ltd

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