Electronics Forum | Fri Dec 04 19:17:03 EST 1998 | Jason
Jeff, I used conductive epoxy for diebonding and chipcaps on hybrid xtal controlled osc. We were applying via stencil printer, then curing in a KME vertical cure, a real foot print saver. Even under controlled environmental conditions, it was a re
Electronics Forum | Tue Oct 27 09:57:37 EST 1998 | Dave
I completely agree with what Dave said previously about the trimming process. I spent the first 6 months at my current job removing this process from our assembly floor. We had several problems with the process including: 1) "flags" from the leads
Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.
Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Thu Feb 12 20:36:26 EST 1998 | Jon Medernach
| Using metal squeegees on GSPs has caused premature stencil wear. Has | anyone had any success with this combination? How much snap off did you | use? We are using .5 mm pitch and have a no clean process. Stencil wear is is minimal but exists. T
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
Electronics Forum | Fri Feb 21 11:33:47 EST 2003 | Jaime
Call your glue manufacturer. It sounds to me that the epoxy is not curing properly. You should also test for shear strenght. How many pounds of pressure does it take to "pop" a cured component after it comes out of the oven? What type of oven do you
Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm
Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef
Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;
