Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Clouthier, AMTX "SMT Printing Process for Fine and Ultra Fine Pitch" 1996: Dr. Randy D. Schueller, 3M, Electronic Products Division "Reliability Results For A Wire Bondable Tape Ball Grid Array Package (TBGA)" 1995: Thomas S. Tarter, AMD; Martin P
Heller Industries Inc. | https://hellerindustries.com/browse/page/74/
: 682809---SHORT SHAFT 682772---ROLLER .69" DIA FOR SLED 682808---ALTERED DRIVE SHAFT 682704---1500/1700 &1800 CBS RAIL SUPPORT, SHORT 682874---CBS PLATE ASSY, EXIT 682876---CBS Chain Tensioner ASSY 682773---ROLLER ASSY 682649---1800W SLED CBS 682713---SUPPORT PLATE CBS EXIT ASSY 682846---Sprocket ASSY 20 tooth 3/8 pitch « PREV NEXT
Lewis & Clark | http://www.lewis-clark.com/online-auction-time/
– 30TH Auction Opens June 24, 2020 @ 8:00 AM EST Auction Closing Begins June 30, 2020 @ 1:00 PM EST FEATURED ITEMS 2018 ASM Siplace TX2i High Speed Chip Shooter 2018 ASM TX2 Siplace Pick and Place 2014 ASM D1i Fine Pitch Pick and Place Universal 6360D Radial 5 Inserter Heller 1809 EXL Reflow Ovens 2013 Asymtek
Lewis & Clark | http://www.lewis-clark.com/product/2014-mydata-my200sx-14-pick-and-place/
: Electrical Two-Pole Test HYDRA Electrical Measurement HYDRA High Speed Fast Place Sequence HYDRA Large Component Range HYDRA Fine Pitch Use Outer Slots (2
Baja Bid | https://bajabid.com/product/2018-mycronic-my300-sx-11/
fine pitch In/Out Conveyor bard train In/Out Conveyor fast board change T3 Table Camera: 2K Condition: Complete & Operational Location
| http://etasmt.com/te_news_industry/2013-04-28/4161.chtml
lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and equipment improve the quality and yield of the reflow soldering. Nitrogen reflow has become the
| http://etasmt.com/cc?ID=te_news_bulletin,11361&url=_print
many through-hole components are still manufactured. Some SMDs can be soldered with a temperature-controlled manual soldering iron, but unfortunately, those that are very small or have too fine a lead pitch are impossible to manually solder without
| http://etasmt.com/te_news_industry/2013-05-06/4361.chtml
from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and
| http://etasmt.com:9060/te_news_industry/2013-04-28/4161.chtml
lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and equipment improve the quality and yield of the reflow soldering. Nitrogen reflow has become the
| http://etasmt.com:9060/te_news_industry/2013-05-06/4361.chtml
from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and
