Electronics Forum | Fri Feb 16 15:12:27 EST 2024 | capse
ASMPT SEMI USA, Inc. 7850 S Hardy Drive, Suite 110, Tempe, AZ 85284-112 U.S.A. Phone: +1 602 437 4760
Electronics Forum | Wed Nov 08 19:49:41 EST 2006 | davef
Dr. Brian Toleno wrote that section of the posting that I pasted onto the forum. Try: * �Lead-free Soldering Backward Compatibility�, Pan, et al., IPC/JEDEC Pb-free Conference, San Jose, 2006 * Checking with http://www.ipc.org * Contacting Jianbia
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Wed Nov 02 01:24:07 EST 2005 | arnold
we are encountering a problem on our production. after dipping a copper wire AWG#30 to a leadfree solder the wire becom thinner and easily to break. does the leadfree soler has the capability to weaken the wire (lessen the diameter)after dipping to l
Electronics Forum | Thu Jan 29 05:13:35 EST 2015 | neeraj_iiser
how to solder manganin 0.05mm manganin wire to a copper plate
Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN
Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma
Electronics Forum | Mon Jan 19 20:26:07 EST 2015 | cspasol
Anyone can help me what kind of solder lead use to connect thermocouple wire to pcb for profiling? We use ordinary lead on our profiling and it flats on when reaching 230C temperature. Our required maximum temp is 240C.
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
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