Electronics Forum: /09 (Page 1334 of 1633)

Genrad 2275

Electronics Forum | Thu May 03 09:55:36 EDT 2001 | davef

First place: Try Genrad, but you probably have a good story why you don't want to do that, eh? Second place: Try an used ATE reseller / refurbisher like: * Denver Test Systems 12253 E Alaska Pl Aurura, CO 80012 303 341 7566 fax 0378 Karol Shure

Re: Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc

I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to

Re: Why would I want to use photonic soldering for my rework applications?

Electronics Forum | Wed Sep 20 10:42:05 EDT 2000 | Erick Russell

Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a cl

Re: reflow profile

Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee

The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell

Re: Trimmer placement.

Electronics Forum | Thu Jul 20 17:03:09 EDT 2000 | Darby

Ketan, If you are using a z-axis head, pay very careful attention to the pick up height so that you don't force the head into the component. Also pay very careful attention to the placement height, we set the component height to 0.05 to 0.1mm over th

Solder balls

Electronics Forum | Wed May 09 11:25:29 EDT 2001 | medernach

What type of preheaters do you have on you're wave? I have to agree with Dave. Your leads are not cold, they are hotter than the annular ring on the PCB. This would cause the solder to go to the lead only rather than the component and land pad / a

In AOI, 3D v.s. 2D imaging?

Electronics Forum | Mon May 07 09:47:45 EDT 2001 | orbotech

An ultimate truth in AOI is that "you can not avoid what you can not see". At the post solder stage, 2D inspection is typically not enough as it simply "can not see" everything using a single perspective, and therefore, can not detect all of the faul

fiducial cleaners

Electronics Forum | Wed May 09 20:35:55 EDT 2001 | davef

Beats me. I thought you said "We are seeing a haze left behind on our current cleaners." I don't even know why you need to clean fids. [Are you scrubbing each fid to make it bright and shiney? What's on them? Why are you doing this?][I'm sorry I

Life of a Solder Stencil

Electronics Forum | Wed May 09 11:05:26 EDT 2001 | davef

IPC-7525 "Stencil Design Guidelines" �9 END OF LIFE, states "Stencils should be inspected periodically for damage that would conribute to decreased printing performance. Refer to Section 7 for inspection guidelines." Or words to that effect. Now b

Who can recommend a reliable solder volume measurement m/c?

Electronics Forum | Fri Jun 08 09:39:29 EDT 2001 | mriddle

Dear Mr. Chan, ASC International apologizes for any confusion or mis-representation you have experienced. It is unfortunate that we did not receive your email regarding local S'pore ASC distributors. If, after all this, you may still have an int


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