Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Thu Feb 27 15:02:22 EST 2020 | babe7362000
Does anyone else have issues of certain cover tape that gets stuck in and around the feeders? I have been fighting these 2 tapes all day. I try to tape them to the pocket tape with a twist, but it only works so long. It happens Either because its s
Electronics Forum | Fri Jul 10 14:29:58 EDT 2020 | SMTA-64315913
Can you share some information relative to these questions about your conformal coating process: 1) What process controls do you use for conformal coating? 2) Do you perform manual conformal coating inspection? 3) Do you use AOI for inspecting confor
Electronics Forum | Thu Jul 16 06:24:23 EDT 2020 | indhu
Hi, I recently joined the SMT manufacturing here. I had problem with heavy pallets as it stuck between conveyors. So, I had reduced the pallet thickness by big opening for the pallets. Now, I'm encountering another issue the pallet warpage after refl
Electronics Forum | Wed Jul 29 18:51:29 EDT 2020 | davef
You're asking about unclad FR4 [G10 is not flame retardant] Just ask for 0/0 unclad FR4. Thicknesses: 0.010", 0.020", 0.031", 0.047", 0.059" 0.090" & 0.118" "What do you folks do when you need custom formers?" Call Butler Winding [I receive no benef
Electronics Forum | Wed Aug 05 08:57:23 EDT 2020 | oxygensmd
Snap off is an option to make distance between PCB and stencil. If the distance not enought, adjust the PCB thickness too. Mostly we don't use snap off, I more prefer if the stencil is tight with the PCB - I know, this make the stencil lifetime worst
Electronics Forum | Fri Apr 30 12:06:54 EDT 2021 | proceng1
I have a small board in a 5x5 array. Thickness is .014". The fist build, the array was all routed with mouse-bites. Customer doesn't like the edge left by the mouse-bites. Board house says they can't v-score a board that thin. I'm not sure what o
Electronics Forum | Tue Sep 14 04:16:55 EDT 2021 | mokshamanthra
Thanks DWL, we have a board with double sided SMT components now. and there is an intrusive component on the bottom side which is build first. the connector pin is extending out by 0.3mm and this is causing printing issues when building top side. we
Electronics Forum | Mon Apr 18 12:39:57 EDT 2022 | winston_one
Thanks for all comments. Process was adjusted normally, problem was in PCBs. Microsection of bare boards confirm that the copper thickness in troughholes was unsuffient, sometimes below 10 microns, on soldered boards where there were a problems durin
Electronics Forum | Wed Jan 11 18:59:22 EST 2023 | agrivon
At SMT assembly level, the main HiP mitigation actions to consider should be increasing the stencil thickness/aperture sizes (typically in the 4 corners where warpage is maximal) + possibly reducing the reflow peak temperature as probably indicated i
