Electronics Forum | Mon Mar 15 10:43:06 EST 1999 | grevald
After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voids
Electronics Forum | Mon Mar 15 08:06:46 EST 1999 | Ron Lahat
After rmoving a BGA (plastic)to correct unexplained shorts I installed another BGA using flux only. Checking on an X Ray machine and found two shorts. can anyone give a good explenation ? Thanks Ron
Electronics Forum | Sun Jan 24 19:53:54 EST 1999 | Steve Gregory
| It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not come
Electronics Forum | Fri Jan 15 16:05:06 EST 1999 | Changhong Lin
Need recommendation for Automatic site cleaning machine for BGA rework. (after component removal). Advice on BGA reballing equipment/methods is needed. thanks a lot Lin
Electronics Forum | Mon Jan 11 16:16:52 EST 1999 | Jenna Sweterlitsch
This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? Thanks!
Electronics Forum | Fri Jan 08 02:27:00 EST 1999 | Kwang-Seong Choi
HI! I am a package engineer in Korea. I have some reasons to desolder excessive solder at the lead of TSOP and TSOJ after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. Does anyone know the
Electronics Forum | Thu Jan 07 05:57:37 EST 1999 | Ken Mok
What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. Ken Mok, based in Shenzhen, China.
Electronics Forum | Tue Oct 27 05:51:28 EST 1998 | jacqueline coia
Could you please tell what are the current avaliable standards, if any (BSI/IPC) for a measurement value on the mechanical pull strength on SMT IC leads after reflow. Thanks in advance, Jack.
Electronics Forum | Tue Nov 17 18:32:18 EST 1998 | Erick Russell
Nicolet Imaging systems in San Diego has everything from Manual Systems to inline, Automated systems for low mix high volume applications. Your eyes get tired after 4,000 cell phone inspections.
Electronics Forum | Sun Oct 11 13:45:21 EDT 1998 | Vincenzo Longobardo
Dear Park Kyung Sam, your problem can be solved asking to your PCB supplier to cover all the via holes with solder mask before the HAL. Usually this is possible and doesn't produce extra cost. Vincenzo Longobardo vinlong@tin.it
