Electronics Forum | Mon Mar 27 21:09:29 EST 2006 | ms
Thanks Dave I'm not convinced the air is necessarily in the paste from manufacture - suspicious that it may be folding in during the change in direction of the print cycle - or as the paste travels across apertures. It is not necessarily in the fir
Electronics Forum | Wed Feb 28 07:40:26 EST 2007 | realchunks
Hi Roderick, Guess it depends on how you define "minor". If it is just a visual blemish in the mask, there will be no affect o the BGA. If it is through the resist there may be a chance of solder shorting, which will affect it, I doubt it but poss
Electronics Forum | Thu Mar 22 12:52:58 EDT 2007 | JD
Hi all, just wondering what everyone is using for production microscopes. Our operators are not in love with the standard eyepiece microscopes. We have an old Vision Engineer stereo dynascope that everyone loves but cant find anymore. The new Mantis
Electronics Forum | Fri Jul 27 12:13:57 EDT 2007 | jdumont
We have issues with these also. They need to be flat to solder well. Reduce the square under the part for the heat sink and youll improve yields. That pad keeps the part lifted high while the other smaller joints reflow and partially attach. You can
Electronics Forum | Mon Oct 26 15:38:27 EDT 2009 | davef
We believe that some suppliers replace nickel with cobalt in SN100 to product a shinier, less grainy, more attractive lead-free solder connection. SN100E sales-types like the idea that it is available in paste, bar stock, and other forms; as compare
Electronics Forum | Wed Oct 19 20:04:06 EDT 2011 | warwolf
yeah I’ve tried to go down the road of internal recycling but the company carnt justify spending 20k on a machine that does it. Ah but where still onto it in other places though our SMT department has very minimal wastage on solder paste as we have b
Electronics Forum | Tue Aug 20 08:29:57 EDT 2013 | proceng1
When bridging becomes an issue, I like short leads. Lead Free is where I see most bridging occur. Usually when lead length starts to approach lead spacing. As long as the lead is discernible in the joint, it's acceptable. If you are having troubl
Electronics Forum | Fri Apr 21 22:13:14 EDT 2023 | jamesatqkits
It is pretty high, I will have to try it with no exhaust, thanks for the idea. Have a great weekend. I should also mention someone that knows metal alloys told me that that much extra Nickle can cause the melt point to go up. Does anyone run hotter t
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
