Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture
Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Sat Oct 06 08:27:24 EDT 2001 | davef
Yes, some solder masks do not tent well, because the material is too thin. That�s the trade-off. Thin masks: * Conform well to [don't bleed onto] fine pitch features. * Tent vias poorly, requiring an additional "plugging" step. As you imply, if th
Electronics Forum | Wed Oct 31 11:10:28 EST 2001 | Claude_Couture
In theory, no tweaking is necessary. Unless you happen to work with equipment old enough to vote! We have several lines with old MK chip shooters. of course, we use the same program for all the lines. There is no way to calibrate each machine so that
Electronics Forum | Tue Oct 16 11:51:26 EDT 2001 | bobm
i am using the epibond. i had alpha come in and look at our set up. they told me that the epibond can be reflowed at regular temp profiles with no problems. because i only have one oven and two pick n place machines it was important to be able to run
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Tue Oct 30 19:42:44 EST 2001 | davef
Jim Blankenhorn [www.smtplus.com] has the best understanding of designing pads for real life. That�s because he designs them like he wants to design them and doesn�t negotiate with a committee of thousands for an IPC standard. Consider doing this
Electronics Forum | Fri Nov 02 08:30:40 EST 2001 | fmonette
For double-side reflow boards, take note that if you have moisture-sensitive components on the first side, you will need to track their remaining floor life up to the final reflow. This is because the reflow process is too fast to effectively remove
Electronics Forum | Wed Nov 07 08:06:29 EST 2001 | hany_khoga
Dear All : 1- We assemble mixed technology boards. For some reasons, sometimes we store them semi assembled (only SMT). Knowing that they have plastic BGA,s , can the wave solder m/c affect or damage those BGA,S on continuation their production?
