Electronics Forum | Tue Aug 22 09:30:31 EDT 2000 | Kelvin Chow
Mr. Lee, Although most of the lead free alloy used for solder paste and wave soldering have been identified, a suitable alloy used for leaded Ic packages (like QFP, PLCC..etc) have not been identified yet. Do you have any suggestion on this lead-f
Electronics Forum | Fri Dec 31 20:21:26 EST 1999 | Stu Leech
Intel had a similar problem with one of their military packages. They had "dull" leads. QC screamed loudly about this because the "dull" leads looked like a solder-coating problem. (Actually the solderability was equal or better than the "shinny" lea
Electronics Forum | Tue Jun 29 16:09:44 EDT 1999 | Dave F
| Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liquid solder. Nickel barrier unde
Electronics Forum | Thu Aug 26 10:03:17 EDT 1999 | Sal
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Tue Apr 27 16:04:00 EDT 1999 | Frank Boyko
We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. Lately, we have been having solderability problems with boards with this surface from some of our suppliers. We are considering trying boards with White Tin solderable surfaces such D
Electronics Forum | Tue Apr 20 16:41:52 EDT 1999 | Justin Medernach
| I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following cr
Electronics Forum | Tue Aug 25 09:29:59 EDT 1998 | Richard Scarcelli
Would like to know the following information on processing micro bga's: 1) Fine mesh solder paste .vs. tacky flux --- which is best 2) Stencil thickness for solder screen 3) Aperature size for standard pitch balls 4) Which direction is the marke
Electronics Forum | Fri Sep 11 10:52:25 EDT 1998 | Javier Carrera
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Mon Jun 22 13:56:17 EDT 1998 | Upinder Singh
hi all. I am looking for a oven which can cure the conformal coating providing heat and the humid atmosphere. I am looking for a temperature range of 60 deg C to 80 deg C and a humidity range of around 80%. Can anybody refer to me the right vendors
Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon
| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a
