Electronics Forum | Wed Aug 12 00:01:56 EDT 1998 | Peter
I have a customer who is transitioning from 100% thru hole boards to designing boards with smt components. We gave them our basic DFM guidelines and they have laid out 2 boards following these guidelines. When I saw the result of their first pass, I
Electronics Forum | Fri Jun 28 01:06:49 EDT 2002 | Dreamsniper
Hi Steve, We have a Heller 1088 (4 Zone Oven) and we are using Indium NC92 with 2% silver. My Oven setting is: Zone 1 Top & Btm 125 Zone 2 Top & Btm 145 Zone 3 Top & Btm 188 Zone 4 Top & Btm 265 Belt Speed 34 cm/min I have run a profile
Electronics Forum | Wed Sep 18 15:43:33 EDT 2002 | dougt
Someone that makes conveyors just called me to argue about a smema problem we had with his conveyor and our machine. He caught me off guard and I wasn't the person that handled the problem so I stumbled through this initial conversation. Now that I
Electronics Forum | Tue Jan 28 18:38:36 EST 2003 | joeherz
Mike, I've tried the high side of the flux preheat spec with no success. I did just get off the phone with Electrovert tech support...... Get ready. This machine is configured with a Contour Plus N2 nozzle. We are not running N2. According to M
Electronics Forum | Tue Jun 01 10:11:00 EDT 2004 | davef
Intermetallic growth is a diffusion process, the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the activation energy and R (8.314 J mo
Electronics Forum | Tue Sep 20 14:13:43 EDT 2005 | Rich
I use Cad2Cad v1.5 with Phillips Topaz. I don't know how much is differs, try this: Converting data to a Philips VIOS Text File format: 1. Open the pick and place data in Excel and format it to look like table 1. ** Make sure you delete the �mm�
Electronics Forum | Mon Dec 19 08:56:18 EST 2005 | davef
Q1a. If the thickness of the silver is too much (how is too much??), A1a. We have heard stories of using Ag2 to limit silver [or gold] dissolution, but have never seen formal studies to demonstrate that idea. First, exclude the use of silver plate
Electronics Forum | Thu Jan 19 15:21:54 EST 2006 | GS
my experience: End '80 beg '90 we use a solution like that. Along the assembly lines, next to P&P machines we use to get dry cabinets (cheap and simple cabinet) where to put inside of SMDs (reel & trays once out of MBB ) during the waiting time from
Electronics Forum | Tue Nov 20 19:08:15 EST 2007 | Peter
Hello, I would like to ask for opinion on an epoxy application. We apply RTV to bond and secure 2 electronic devices on a PCB. But after noticing the RTV bond breaking off during vibration test, our customer has specs in a 5min 2-part epoxy (made
Electronics Forum | Thu Jun 26 20:54:08 EDT 2008 | davef
As pointed-out above, the downside of telling your supplier how to perform a process can create problems: * It sets the cost of the operation ... I did what you told me to do * Materials selected may be incompatible ... I did what you told me to do *
