Electronics Forum: boarded (Page 1370 of 1638)

Re: Cleaning No Clean Wave Solder Carriers

Electronics Forum | Fri Jan 08 17:56:16 EST 1999 | Eric Miller

Hi Chrys, Hate to bring you down, but, wave solder pallets exposed to any kind of flux is subject to "Build up" on the carrier. You still have to clean them, hopefully on a regular basis.If the pallet is being run in a high production envirnment, I w

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow

Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h

Re: CSP Assembly- SIR Test

Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen

Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,

Re: TCP (tape carrer package?)

Electronics Forum | Tue Dec 15 17:01:36 EST 1998 | Chrys

| Does anyone know what a TCP is? | What type of process is required for assembly, what type of equipment? | | Any help or resources on the subject would be greatly appreciated.. | | Thanks | Brain, TCP, or tape carrier package is the same as TAB

Re: Describe term A wave

Electronics Forum | Tue Dec 15 15:21:24 EST 1998 | Chrys

| SMTneters, | I'm famialiar with lambda, omega, and gemini waves but not with "A" wave. Can somebody give me an explanation? | | thanks | | Tom B. | Tom, The term "A" wave refers to an asymetrical wave. It's an Electrovert term that describes

Batch Cleaners

Electronics Forum | Tue Dec 08 11:49:44 EST 1998 | Dave F

All Y'All: A recent (10/98) article in "Circuits Assembly" magazine touted the use batch cleaners using a aqueous alcohol solvent. Reported benefits of this approach were: 1 Better use of floor space 2 Ability to develop custom recipes 3 Ability

Questions regarding rework

Electronics Forum | Mon Dec 07 17:56:45 EST 1998 | Tom Braswell

I have been put incharge of developing a process to rework a doublesided SMT PCB with DCA/COB (direct chip attach, chip on board ) components. The rework will consist of removing some 603-1206 chips on both sides of PCB, oh yeah its has a polyuretha

Re: Conductive Epoxy

Electronics Forum | Mon Dec 07 09:22:50 EST 1998 | rick

| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon

| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is

Re: Alternatives to ReDrilling for Non-Plated Holes Slots

Electronics Forum | Thu Nov 26 06:05:32 EST 1998 | Earl Moon

| Certain board designs require the unavoidable use of non-plated holes and slots. Presently, this requires a trip back to the drill house to open up the aforementioned holes, to remove the unwanted plating. In situations requiring non-plated holes a


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