Electronics Forum: electronic assembly (Page 138 of 598)

BGA,s Storage

Electronics Forum | Wed Nov 07 08:06:29 EST 2001 | hany_khoga

Dear All : 1- We assemble mixed technology boards. For some reasons, sometimes we store them semi assembled (only SMT). Knowing that they have plastic BGA,s , can the wave solder m/c affect or damage those BGA,S on continuation their production?

Immersion Silver

Electronics Forum | Fri Jan 11 11:14:14 EST 2002 | leedianeh

I am going to be using large numbers of silver immersion PCB's for assembly. I am concerned about long term storage ( shelf life )and handling prior to placement/assembly. The recommended 'shelf life' appears to be 6 months but obviously this will

Flexi Circuits Assembly

Electronics Forum | Sat Feb 02 09:48:27 EST 2002 | davef

We've talked about assembling on flex previously. Search the fine SMTnet Archives for background. Issues that come to mind [which is very risky, given that this Saturday morning and last night was at Jimbo's] are: * Use carriers that can flow thoug

BGA Assembly

Electronics Forum | Tue May 28 17:33:31 EDT 2002 | wilcoxito

We are just getting started doing BGA assembly at our plant. Any helpful hints would be greatly appreciated. My first main question is about stencils. We are considering using diamond shaped holes for the BGA pads. Does anyone have any experience

Managing Production Schedules

Electronics Forum | Thu Jul 18 08:14:25 EDT 2002 | CAN

Does your company use an MRP system? If so you should be able to print a report that defines assembly due dates as well as the time it takes to process each assembly. What I do is print the report at the begining of the week for everyone to work from

PCB baking for rework

Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs

We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to

Solder balls on gold pad

Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr

DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste

PCBA baking prior to rework

Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg

In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 16 17:35:43 EST 2002 | davef

Jim Consider issuing a purchase order to your assembler for the purchase of selective wave soldering pallets required to solder your board. That way, you: * Own the pallets. * Can take the pallets with you should you decide that another assembler

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Tue May 18 09:13:08 EDT 2004 | E Wolf

I'd like to follow the thread discussed on assembly. Hope Everyone is ok with that. I do run into the problem (have it now) that Ionic cleanliness is requested by print on a no-clean assembly. My intention is to use the no-clean to skip the aqueou


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