Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Electronics Forum | Wed Jun 14 18:21:23 EDT 2000 | Robert Moore
It has been our experience that the problem you have discribed was not solder process related. We had two such instances in the past and both were component related. The first case involved a PLCC28 that failed test. Reflowing the solder seemed to co
Electronics Forum | Tue Sep 24 12:58:27 EDT 2002 | dragonslayr
Although focusing on solderability may be the right answer, I wonder if you are satisfied that co-planarity is not the root cause. With random events of contact opens, this may be the case. Cleanliness of the stencil can also be a source of your pr
Electronics Forum | Wed Jun 25 16:40:24 EDT 2008 | bschreiber
As I am certain you have discovered, no clean solder paste has removed most inline cleaners from the production floor and the pallets that were cleaned simultaneously with the PCBs are now accumulating flux residue. Permali, the maker of Durostone
Electronics Forum | Tue Jul 16 12:24:25 EDT 2019 | slthomas
In VERY general terms, water soluble flux is usually better at getting good wetting of the soldered connections unless you have a very well controlled process, in which case no-clean can be very handy (you don't have to clean). Water soluble flux re
Electronics Forum | Tue Mar 21 21:03:55 EST 2006 | davef
1 Chatter about mask opening � No BIG problems with these statements. It�s just that you may need to tailor your reflow recipe to minimize these escapees. 2 Stencil design - Any area ratio below 0.66 is going to very challenging to print, as you ca
Electronics Forum | Wed Dec 06 08:29:50 EST 2006 | David
Hi Pavel, We regularly use over printing on a multitude of problem parts including fine pitch QFP's. In an Automotive Environment the only thing you can change without a mountain of paperwork is the stencil. best way to work out how much you can get
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
