Electronics Forum | Mon Aug 24 22:27:52 EDT 2015 | sarason
Your solder looks like it hasn't had time to reflow. Are`the pictures of an aluminium substrate ? So just positing a theory your boards need more soak time, the solder seems to have formed little hills/mountains and then cooled off before the surface
Electronics Forum | Tue Apr 19 07:23:39 EDT 2016 | clockwatcher
For ESD control in the factory we use foot & wrist straps, and ESD smocks. We also have ESD work surfaces including ESD flooring throughout the plant. We have been using ESD chairs and now the question has come up on if and how often these chairs nee
Electronics Forum | Tue Apr 26 07:56:12 EDT 2016 | joelperez
Hello SMTnet team, I have read before that silver content on solder joints is ok at around 2% total silver content. Does anyone has experience using SN62/PB36/AG2 BGAs on hard gold (10 micro inches) PCB surface finish? Any drawbacks? Thanks Joel
Electronics Forum | Wed Jan 04 07:32:35 EST 2017 | pavel_murtishev
Good day, Having recieved new batch of PCBs with OSP surface finish, I have noticed that some polygons not covered by solder mask and solder paste become darker after second reflow cycle compared to PCBs not being sent to reflow. I wonder whether i
Electronics Forum | Wed May 03 02:23:11 EDT 2017 | Rob
Many years ago (20+) we did this by preassembling the 2 parts into a mini leadframe with high temp solder paste, which was a pain but then they could be dropped in trays, surface mounted and hit the line clean. I'm guessing you have a low value cap
Electronics Forum | Thu Jul 13 02:30:29 EDT 2017 | jandon
We are using hot-plate. It is the safest method to rework aluminum substrate PCB's. http://www.martin-smt.de/en/rework/products/pre-heater-hotbeam.html "For efficient rework on heavy electrical systems with flat bottom surface and LED PCBs the pow
Electronics Forum | Fri Nov 03 13:58:25 EDT 2017 | mattmunoz2013
Hello, I am currently in the process of purchasing a plasma chamber for the purpose of activating the surface of flex circuits so that they bond more readily. In addition I need to purchase a gas cylinder for the chamber, specifically one that is a
Electronics Forum | Tue Nov 07 22:44:39 EST 2017 | wrander1
Hi I'm new to the world of wire bonding. I seem to have some sort of pad contamination Preventing gold wire from bonding to aluminum pats. There appears to be a dozen microns size particles. And a slight crackling of the surface at 500 X. I am send
Electronics Forum | Tue Nov 28 10:48:29 EST 2017 | georgetruitt
Some things to look into are the component finish, material and composition of the solder, design of the smt stencil, reflow profile or process atmosphere (N2 or air)also contribute to the solder result. The influence of the PCB itself should be co
Electronics Forum | Tue Nov 28 14:27:05 EST 2017 | emeto
Without the details I will tell you that you have too much paste. PCB Pad is probably way bigger than the contact lead surface of the part, you overprint, and in the oven this solder have nowhere to go and tilts your part. Check datasheet.Cutting sma
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
